| Environment Characteristic | |
|---|---|
| RoHS/ Halogen Free(HF) Compliance | HF |
| Solder Process Characteristic | |
|---|---|
| Duration at Max. Process Temperature | 5s |
| Max. Process Temperature | 260℃ |
| Solder Process Type | IR Reflow |
| Electrical Characteristic | |
|---|---|
| Max. Voltage | AC 360V |
| Current Rating | 0.525A |
| Physical Characteristic | |
|---|---|
| Housing Color | Black |
| Durability | 30Cycles |
| Locating Post | N/A |
| Tail Length | N/A |
| Pitch | 0.9144*0.9144 |
| Circuits | 1151 pin |
| Plating Thickness on Contact Area | 15u" |
| Plating Material on Contact Area | Au |
| Contact Material | C7025 |
| Housing Material | LCP |
| Product General Characteristic | |
|---|---|
| Orientation | Vertical |
| PCB Mount Type | SMT |
| Component Type | Receptacle |
| Product Overview | SOCKET1151 SMT,Sn/Ag/Cu;HF |
| Others | |
|---|---|
| Packaging | Tray |
