Environment Characteristic | |
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RoHS/ Halogen Free(HF) Compliance | HF |
Solder Process Characteristic | |
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Duration at Max. Process Temperature | 5s |
Max. Process Temperature | 260℃ |
Solder Process Type | IR Reflow |
Electrical Characteristic | |
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Max. Voltage | AC 650V |
Current Rating | 1 A |
Physical Characteristic | |
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Housing Color | Black |
Durability | 30 Cycles |
Locating Post | N/A |
Tail Length | N/A |
Pitch | 1.00mm(X) x1.00mm(Y) |
Circuits | 1331 pin |
Plating Thickness on Contact Area | 1u"&10u"&15u" |
Plating Material on Contact Area | Au |
Contact Material | Copper Alloy |
Housing Material | LCP |
Product General Characteristic | |
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Orientation | Vertical |
PCB Mount Type | SMT |
Component Type | Receptacle |
Product Overview | SOCKET AM4,1331Pin,SMT,Vertical,Black,HF |
Others | |
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Packaging | Tray |