Product General Characteristic | |
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Product Overview | TYPE—C DIP+SMT CONN |
Component Type | Receptacle |
PCB Mount Type | DIP+SMT |
Orientation | Right Angle |
Physical Characteristic | |
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Housing Material | LCP |
Contact Material | Brass |
Plating Material on Contact Area | Au |
Plating Thickness on Contact Area | 1U“ |
Circuits | 24Pin |
Pitch | 0.5 |
Tail Length | 1.8mm |
Locating Post | 0.55 |
Durability | 10000Cycles |
Housing Color | Black |
Electrical Characteristic | |
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Current Rating | 5A |
Max. Voltage | 5V |
Solder Process Characteristic | |
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Solder Process Type | IR Reflow |
Max. Process Temperature | 260℃ |
Duration at Max. Process Temperature | 10s |
Environment Characteristic | |
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RoHS/ Halogen Free(HF) Compliance | HF |
Others | |
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Packaging | Reel |