Product General Characteristic | |
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Product Overview | RJ45 1X1 TAB_UP DIP CONN.47.5° |
Component Type | Receptacle |
PCB Mount Type | Thru-hole |
Orientation | 47.5 Angle |
Physical Characteristic | |
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Housing Material | PA9T |
Contact Material | Brass |
Plating Material on Contact Area | Au |
Plating Thickness on Contact Area | AU 30u“ |
Circuits | 10pin |
Pitch | 1.27mm |
Tail Length | 3.17mm |
Locating Post | 2.5mm |
Durability | 1000Cycles |
Housing Color | Black |
Electrical Characteristic | |
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Current Rating | 1.5A |
Max. Voltage | 30V |
Solder Process Characteristic | |
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Solder Process Type | IR Reflow |
Max. Process Temperature | 260℃ |
Duration at Max. Process Temperature | 10s |
Environment Characteristic | |
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RoHS/ Halogen Free(HF) Compliance | HF |
Others | |
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Packaging | Tray |