| Environment Characteristic | |
|---|---|
| RoHS/ Halogen Free(HF) Compliance | HF |
| Solder Process Characteristic | |
|---|---|
| Duration at Max. Process Temperature | N/A |
| Max. Process Temperature | N/A |
| Solder Process Type | N/A |
| Electrical Characteristic | |
|---|---|
| Max. Voltage | N/A |
| Current Rating | N/A |
| Physical Characteristic | |
|---|---|
| Housing Color | N/A |
| Durability | N/A |
| Locating Post | N/A |
| Tail Length | N/A |
| Pitch | N/A |
| Circuits | 2011 pin |
| Plating Thickness on Contact Area | N/A |
| Plating Material on Contact Area | N/A |
| Contact Material | N/A |
| Housing Material | N/A |
| Product General Characteristic | |
|---|---|
| Orientation | N/A |
| PCB Mount Type | N/A |
| Component Type | CPU Sokcet ILM |
| Product Overview | SKT 2011 ILM&BP |
| Others | |
|---|---|
| Packaging | Tray |
